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Immersion Lithography
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Immersion Lithography Simulator
Water-Based NA Enhancement | Bubble Defects | Leaching & Topcoat Analysis
0
Effective NA
0
Resolution (nm)
0
DOF (nm)
0
Bubble Defects
0
Leaching Rate (ng/cm²·s)
Immersion Parameters
NA_eff = n_medium × sin(θ) | Resolution: R = k₁λ/(n×NA)
DOF = k₂λ/(n×NA²) | Bubble: P_critical = 2γ/r (Young-Laplace)
Leaching: dm/dt = -k_evap × A × (P_sat - P_ambient)
Water Refractive Index
1.436
Numerical Aperture (NA)
1.20
Immersion Gap
2.5
mm
Water Temperature
23
°C
Bubble Size
20
µm
Bubble Density
3
/mm²
Scan Speed
400
mm/s
Topcoat Thickness
30
nm
3D Water Gap Visualization
Resolution vs NA (Immersion vs Dry)
DOF vs NA Comparison
Bubble Defect Map (Wafer)
Bubble Size Distribution
Effective NA Calculation
Topcoat Leaching Rate
Water Temperature Gradient