Project Overview
Developed a comprehensive 3D heterogeneous integration solution for RF front-end modules targeting 5G mmWave applications and high-speed chiplet interconnects. This project demonstrates advanced co-design methodologies combining electromagnetic simulation, thermal analysis, and signal integrity optimization.
Key innovations include novel antenna-in-package (AiP) design, compartmental EM shielding, and multi-physics co-optimization for next-generation System-in-Package (SiP) technologies.
Key Features
- 28 GHz phased array antenna-in-package (4×4)
- 112 Gbps PAM4 SerDes signal integrity
- 3D EM co-simulation with HFSS/ADS
- Thermal-aware power distribution network
- UCIe chiplet interconnect design
Interactive Demos
Beamforming Pattern
4×4 phased array with steering, spacing, and frequency controls
S-Parameters Sweep
S11/S21 vs frequency with via diameter sensitivity
Thermal Model
Transient junction temperature with power and Rth controls
PDN Impedance
Power distribution network Z(f) and VRM step response
Crosstalk Analysis
Interposer/TSV near-end and far-end crosstalk
UCIe Eye & BER
Eye diagram with jitter/noise and BER analysis
Design Tools
S-Parameter Analyzer
Smith chart and frequency response
Impedance Matching
L, Pi, T network design
Antenna Pattern
3D radiation pattern visualization
Co-Design Optimizer
Multi-objective optimization
Stackup Designer
Multi-layer PCB/package stackup
Filter Designer
RF filter synthesis
Transmission Line
Microstrip, stripline, CPW
Component Library
RF passives and IC models
Documentation
System Architecture
RF Front-End Module
- 28 GHz phased array antenna (4×4)
- GaN PA with 20 dBm output power
- LNA with 2.5 dB noise figure
- Integrated T/R switch and phase shifters
Packaging Technology
- Fan-out wafer level packaging (FOWLP)
- Through-silicon vias (TSV) integration
- Embedded die technology
- Low-loss organic substrate (Df < 0.003)
Key Results
- < -10 dB return loss across 26-30 GHz band
- Antenna gain of 12 dBi with ±45° beam steering
- RF-digital crosstalk < -40 dB
- Thermal resistance 2.5 °C/W with heat spreader
- 64-QAM modulation at 2 Gsps demonstrated