Thermal Analysis

Package thermal simulation and junction temperature mapping

Power Dissipation

Die Power: 15 W

PA Power: 5 W

SerDes Power: 3 W

Cooling

Ambient Temp: 25 °C

Heatsink Type

TIM Conductivity: 5 W/mK

85°C

T_junction

65°C

T_case

2.5°C/W

θ_JA

PASS

Tj < 105°C

Temperature Map

Thermal Stack

Temperature Profile

Transient Response