Advanced modeling of plasma sheath formation, ion acceleration, and energy/angular distributions. Simulate Child-Langmuir sheath voltage, Bohm criterion, RF modulation effects, and ion trajectory dynamics critical for anisotropic etching.
The plasma sheath is a thin boundary layer with strong electric fields that accelerates ions toward the wafer surface. The ion energy distribution function (IEDF) and angular distribution determine etch anisotropy, selectivity, and damage. RF bias creates time-varying sheath voltages crucial for directionality control.
Ions must enter the sheath with minimum velocity (Bohm velocity) for stable sheath formation:
The sheath voltage drop is governed by space-charge limited current:
The Debye length scaled sheath thickness:
For collisionless sheath, ions gain energy from sheath voltage:
Time-dependent sheath voltage for capacitively coupled RF:
Angular spread due to lateral ion temperature and collisions:
The ion saturation current density:
The quasi-neutral presheath accelerates ions to Bohm velocity: