Production floor experience and graduate process knowledge
Worked on the YieldStar 375F, 380G, and 1385 optical metrology systems on the Wilton production floor: sub-system assembly, optical alignment, functional testing, equipment calibration, station setup, and process development support.
Two years on the ASML Wilton production floor, building the metrology systems that support EUV, DUV, immersion lithography, and multi-patterning processes. Familiar with mask alignment, overlay, critical dimension control, and resist processing concepts from coursework and from the production-floor context.
Sensor alignment, UIA alignment, focus branch, Z-stage installation, Pupil Branch, Alignment Branch, Reference Branch, cables and covers, pre-qualifications, and final qualifications.
Measured sensor performance, calibrations, alignment of branch optics, objective lens performance, and diffraction-based overlay measurements.
Standardized tools and electronic equipment for assembly, install, removal, testing, and troubleshooting: torque wrenches, electric and pneumatic screwdrivers, ball drivers, lifting equipment, computers, oscilloscopes, voltage and current probes, multimeters, micrometers, and calipers. Optical fibers, spectrometers, and power meters for results acquisition and analysis.
Performed root cause analysis on production issues with the SAP system, Opti Angle, and YieldStar software; developed corrective actions and monitored results.
Participated in cross-functional teams with manufacturing, quality, and procurement. Assisted with recommended changes in design, methods, and procedures to enhance product quality. Built Excel spreadsheets to track key performance indicators.
Built coupled electrothermal TCAD models of AlGaN/GaN HEMTs to characterize self-heating, junction temperature behavior, and DC/RF performance trade-offs across bias conditions. Calibrated material parameters, mesh strategy, and contact models against published device data.
Wide bandgap device physics, electrothermal modeling, self-heating, and the connection between device-level findings and process integration, reliability, and yield. Includes work on vertical GaN power devices in the lab.
Sentaurus and Silvaco TCAD for device process co-simulation, electrothermal modeling, and calibration against published data.
Applied model-comparison study for EUV/DUV lithography. Benchmarks aerial-image energy deposition predicted by a Double-Gaussian PSF (FFT convolution) against a Monte Carlo particle model. Includes partial-coherence modeling, flare analysis, and swing curves.
25 to 50 Gbps silicon photonics transceiver simulation framework using Lumerical-style modeling. Compact model development, link budget analysis, and process variation sensitivity.
In active development. A semiconductor characterization and manufacturing execution platform combining Python/FastAPI, Next.js 14, PostgreSQL, and Celery + Redis. Covers metrology, seven process control areas, SPC with Western Electric rules, ML and virtual metrology, and a LIMS/ELN.
Process areas covered through UConn coursework, lab rotations, and independent study.
Physical Vapor Deposition (PVD, sputtering), Chemical Vapor Deposition (CVD, including PECVD and LPCVD), Atomic Layer Deposition (ALD), and high-k dielectrics. Coursework and lab familiarity.
Reactive Ion Etching (RIE), Deep Reactive Ion Etching (DRIE), plasma chemistry, and Chemical Mechanical Planarization (CMP). Coursework and lab familiarity.
Statistical Process Control (SPC), Design of Experiments (DOE), 8D root cause, FMEA, Pareto analysis, Minitab, JMP. Applied at ASML on production-floor root cause workflows.
Worked in ASML Wilton's cleanroom environment under strict safety procedures and 5S+1 requirements. Wore coveralls, hoods, booties, safety glasses, and gloves for the entire duration of 12-hour night shifts.
Contamination control, ESD discipline, change control, and ISO 9001 quality system principles. Process and inspection documentation supporting traceability and continuous improvement.