Electronics
Advanced Hardware & Semiconductor Systems Portfolio
Defect Detection & Yield Prediction with ML
Applies machine learning to classify wafer/SEM image defects and predict semiconductor yield. Uses CNNs and Bayesian methods to address rare defect classes and enhance yield forecasting accuracy.
GaN Power Device Characterization
Comprehensive analysis and optimization of GaN-based power devices for high-efficiency applications.
Neuromorphic Computing Research
Memristor-Based AI Hardware Architectures: Partitioned Crossbar Accelerator for Energy-Efficient Neural Networks
Phase Change Memory Research
Advanced GST-based PCM device simulation with JMAK crystallization kinetics, electro-thermal modeling, and reliability analysis for next-gen non-volatile memory.
Solid-State Transformer Platform
Advanced SST platform with SiC/GaN devices for EV DCFC, servers/data centers, and national grid integration. 3-stage architecture (NPC→DAB→INV), medium-frequency transformer design, ZVS optimization, and IEEE-1547 grid services.
Atomic Layer Materials Process
Advanced atomic layer deposition (ALD) and etching processes for next-generation semiconductor manufacturing. Research on ultra-thin film growth, surface chemistry, and process optimization for sub-5nm technology nodes.
Neural Networks Classification
Development of advanced neural network architectures for multi-class classification problems in semiconductor defect detection and medical imaging. Implementing attention mechanisms and transfer learning for improved accuracy.
IoT Robotics in Manufacturing V2
Enhanced implementation with deterministic real-time control (TSN/PTP), SEMI standards integration, and Bayesian ML predictions. Features interactive robot control, cleanroom monitoring, and RUL prediction with <1ms latency.
Advanced Lithography Research
Comprehensive photolithography process development featuring EUV/DUV tool operation, OPC/RET optimization, metrology analysis (LER, CD-SEM, overlay), and yield enhancement. Includes reticle management, aerial image simulation, and defect inspection with real physics modeling.
CVD & PVD Deposition Suite
Advanced thin film deposition modeling including PECVD, LPCVD, ALD, sputtering, and evaporation. Features atomic-scale simulations, step coverage analysis, film stress calculations, and ML-based property prediction with angstrom-level precision for 50+ materials.
CMP Models and Simulation
Comprehensive review of Chemical Mechanical Polishing models for semiconductor manufacturing. Analyzed Preston equation, contact mechanics, tribochemical models, and ML approaches for oxide, copper, and tungsten CMP with MRR prediction accuracy R² > 0.95.
Plasma Etching Simulation Suite
Advanced modeling of reactive ion etching (RIE), DRIE, and ALE processes. Includes plasma chemistry, sheath dynamics, surface reactions, profile evolution with real physics calculations for selectivity >90:1 and aspect ratios >100:1.
Hardware & Embedded Systems
High-Efficiency DC-DC Converter with Digital Control
Synchronous buck/boost DC-DC converter (12V → 1.2V) achieving >90% efficiency with digital PID control. Features mixed analog-digital hardware design, PCB layout, and comprehensive testing for EV, CPU/GPU, and aerospace power systems.
RISC-V SoC with Custom Accelerators
Full RISC-V RV32IMC processor implementation with custom vector accelerator, AXI4 interconnect, DDR4 controller, and hardware security module. Synthesized on Xilinx Zynq achieving 200MHz with integrated ML inference engine.
PQC on RISC-V: Hardware-Accelerated Post-Quantum Crypto SE
Systems-engineering project: Kyber768 (ML-KEM, FIPS 203) and Dilithium3 (ML-DSA, FIPS 204) accelerated as a custom RISC-V instruction extension on Xilinx Kria. Includes architecture, trade studies, side-channel threat model, V&V plan, Python reference, SystemVerilog RTL skeleton, cocotb testbench, and CI. Direct extension of the RISC-V SoC project above.
IoT Edge Device with Sensor Fusion & Wireless Connectivity
Advanced IoT prototype combining multi-sensor fusion (IMU, temperature, microphone) with wireless connectivity and on-device TinyML for anomaly detection. Features board-level design, firmware development, and real-time dashboard for industrial IoT applications.
RF & Semiconductor Design (2 Projects)
mmWave RF Frontend Design
Complete 28GHz 5G RF frontend with beamforming array, featuring GaN PA with 35dBm output power, sub-6dB NF LNA, and adaptive impedance matching network for MIMO applications.
RF/High-Speed System-in-Package (SiP) Co-Design
3D heterogeneous integration of RF front-end modules with full-wave EM simulation. Includes antenna design, filter optimization, and crosstalk analysis for 5G mmWave modules and high-speed chiplet interconnects using advanced packaging technologies.
Undersea Systems Engineering Projects
Mini-UUV Systems Demo
Volume/mass-constrained mini-UUV demonstrator with modular payload bay and simulated effects integration. Navigation stack fused IMU + doppler surrogate + acoustic beacons with 1.2%/hr drift, 75–110 min endurance @ 50–80 W, hot-swap payloads ≤ 0.8 L/700 g.
Cross-Domain Undersea Comms & Spectrum Sensing
Tri-link undersea comms chain: acoustic OFDM modem, blue-green optical burst, and RF relay buoy with spectrum-sensing. Achieved 350–900 bps acoustic at 0.8–1.2 km, 2–8 Mbps optical at 5–20 m LOS, and < 250 ms end-to-end latency via buoy.
Undersea Navigation & Positioning Systems
Advanced underwater navigation and positioning systems for autonomous underwater vehicles. Integrated inertial navigation with acoustic positioning, doppler velocity logging, and terrain-aided navigation for robust positioning in challenging underwater environments.